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@cpresser |
Thanks for the hint; I meant to write Description - Above post was edited. |
The current ML package spec (http://ww1.microchip.com/downloads/en/DeviceDoc/16L_QFN_4x4_ML_C04-0127D.pdf) still gives the same dimensions. |
So do we stick with the 2.1mm or do we create a 2.5mm? |
See KLC F6.3 EP may vary within MF recommendations but must at least be minimum package pad size. |
So a new footprint it is. |
Yep. As @chschlue did point out. KLC F6.3 is quite specific:
But you can use the generator scripts for that, making it quite easy to create a new FP. Just copy one of the existing ones in the .yaml file and change the EP size. Also check the other values so they are the same as in the data-sheet. Please also note that there were quite a few other things that need to be changed before we can merge it. The checklist is in my first post. I will do another check once you addressed those points. |
@cpresser I've fixed the issues in the checklist and here are the PRs for the footprint. Generator PR: pointhi/kicad-footprint-generator#430 |
Also the FP filters need a little work:
@cpresser |
You are correct, there was a typo (14, meant 17). Fixed it in the post above. /me should be more carefull. Regarding the stacking of the EP: Afaik other parts in this lib also stack EP even if it is just recommended. My argument is also that nothing else can be connected to EP but GND. So the user does not really have any freedom on what else to connect/route to the center pad. Nevertheless, the non-stacking variant is also valid. In this case Pin17 should be an invisible NC pin, so the user can't connect it to other nets. |
Pin 17 should be a separate pin, visible, and on the bottom next to the pin 3/4 stack. The user can then do three things with the thermal pad:
This library may be a bad example (one of many!) but this is done elsewhere to give the user all possibilities without forcing a connection that they may not want. |
@evanshultz I get your points. And they are totally valid. If the goal is to have every option to the user than that is the way to go. What do you think the pin-type for Pin17 EP should be? passive? That might give the least ERC errors. I can't find a KLC rule for this special case. Its neither a hidden nor a NC pin. Do you think we should clarify the KLC for this (not so) special case? @JeppeSRC please do as suggested by evanshultz. |
Yes, pin 17 should be Passive type. This is the only way I can recall it being done for years since I started and have seen PRs reviewed. I'm sure there are many symbols that don't conform, and v6 would be the next opportunity to revamp them. Having KLC capture this and an issue to track naughty symbols would be nice. @cpresser |
Added MCP4251
Datasheet
I ended up creating 3 different symbols for PDIP, SOIC, TSSOP packages even if they have the same pinout, because the QFN package didn't have the same pinout.
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